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GAIA ENERGY

KO

Semiconductor and solar cell business

Reflow

Home > Semiconductor and solar cell business > Semiconductor equipment > Reflow

Equipment overview

In order to reduce power consumption over 50%, H₂ gas consumption over 50%, and equipment installation space over 50%, we have been developed Reflow process equipment with a low-cost, high efficiency, high emissivity by far infrared radiation to solder electronic parts and PCB in SMT process.

Item Specification
Basic configuration
  • - Master Oven 1 (preheating)
  • - Slaver Oven 4 (heating, cooling)
Temperature Separate configuration for each oven (controlled by Master)
C / V speed Programable(Motor, Inverter)
Distinction
  • - Configurable by adjusting the number of slaves according to production capacity
  • - Easy to change temperature and speed
  • - Easy removal of slave oven - Slave Oven One Touch completes line configuration

Equipment Specifications

Item Specification Remark
Application PKG
  • · SAMSUNG LED APPLICATION ONLY
FOOT PRINT
  • · 3000 x 1130 x 1100 mm (LxDxH)
 Can be changed after detailed design
PATH LINE
  • · FL+950 mm
DIRECTION
  • · Left → Right
PCB Size
  1. 1) R -Lamp :184.5×159,181×159,141×159
  2. 2) L-Ramp : 620×296, 650×345, 490×345
TEMPERATURE
  1. 1) RT ~ 250℃
  2. 2) Controller Accuracy : ±0.1℃ at 250℃
  3. 3) Uniformity about Temp. Profile : ±3.0℃
  4. 4) Temp. Uniformity of PCB at Carrier? : Under ±30℃
  5. 5) Temp. Rising Speed : RT ~ 150℃ / 20min ↓
  6. 6) Temp Variation in Chamber : Under 1℃
  7. 7) Over Temp Alarm Occurrence on Machine Stop and Alarm
CONVEYOR
  • · TYPE: SUS MESH BELT
  • · SPEED : MIN 0.3 m/min ~ Max. 2.0m/min
CLEAN CLASS
  • · CLASS 1000
UTILITY
  • · AIR: 7 kgf/㎠ (LINECDA), N2 · 220 V 3 PHASE
 Can be adjusted